8-layer HDI PCBs with ENIG

8 layer,
HDI with 1+N+1 structure,
FR4(Tg170) material,
1.6mm thick,
H OZ base copper on inner layers,
0.33OZ base copper on outer layers, 
ENIG surface finish, matte green solder mask,
Copper fill by VCP process,
Min w/s(line width/spacing) 3.5/5.5 mil,
With impedance control,
Min BGA pad 0.30mm,  
Min mechanical drill bit 0.225mm,
With Laser via holes from layer1 to layer 2,  from layer 7 to layer 8