Special Features:
20 layer,
HDI with 4+N+4 structure,
FR4(370HR) material，
3.5mm thick,
H OZ base copper on all layers,
ENIG surface finish, green solder mask,
Copper fill by VCP process,
Min w/s(line width/spacing) 4.0/5.0 mil,
Min BGA pad 0.45mm,
Min mechanical drill bit 0.30mm,
With Laser via holes from layer1 to layer 2, from layer 19 to layer 20.
With buried holes from layer 2 to layer 19.
