10-layered HDI PCBs with ENIG and hard golf finger

10 layer,
HDI with 1+N+1 structure,
FR4(Tg170) material，
1.20mm thick,
1 OZ base copper on inner layers,
0.33OZ base copper on outer layers, 
LF HASL surface finish,
With hard gold finger at the edge-board, 
Matte green solder mask,
With resin plugging via holes,
Copper fill micro-vias by VCP process,
Min w/s(line width/spacing) 4.0/4.8 mil,
Min BGA pad 0.25mm,  
Min mechanical drill bit 0.20mm,
With Laser via holes from layer1 to layer 2,  from layer 9 to layer 10, with 3000V hi-pot test