产品展示

Smart Communication Module-1

时间:2021/5/13 22:32:23
点击数:1006

Key Specifications/Special Features:


Application Field: Intelligent navigation module 
Layer Number: 8 Layer Board(2+4+2)
Thickness: 1.0mm 
Trace Width/Space:3/3mil
Surface Treatment: ENIG+OSP

Min drill bit 0.20mm

BGA pad size: 0.25mm

版权所有 @ 广东科翔电路技术有限公司 All rights reserved 粤ICP09646990号