6-layer HDI PCB with ENIG Surface Finish

6 layers
HDI with 1+N+1 structure, without buried holes
FR4 (Tg170) material
1.60mm thick,
1 OZ finished copper on inner layers
ENIG surface finish
Matte green solder mask
Min w/s (line width/spacing) 5.0/5.0 mil
Min BGA pad 0.20mm,
Min mechanical drill bit 0.25mm
With Laser via holes from layer 1 to layer 2,  from layer 5 to layer 6.