| Item | Current | 2016 | 2017 | |
| Max. Layer | 62 | 58 | 60 | |
| Track width/space | inner£¨mil£© | 2.5 / 2.5 | 3 / 3 | 2.5/ 2.5 |
| outer£¨mil£© | 2.5 / 2.5 | 4 / 3 | 2.5 / 3 | |
| Aspect Ratio | 15 : 1 | 14 : 1 | 15 : 1 | |
| Copper Weight (oz) | 12 | 8 | 10 | |
| Impedance tolerance | ¡À5% | ¡À8% | ¡À5% | |
| Material | Microwave material | SV | SV | SV |
| Via in pad | SV | SV | SV | |
| Lead-free | MP | MP | MP | |
| Mix lamination | / | P | SV | |
| Metal Based/Core | P | SV | SV | |
| HiTg | MP | MP | MP | |
| HDI | 1+N+1 | / | P | P |
| Buried resistance/electric capacity | / | / | P | |
| P: Prototype SV: Small Volume MP: Mass Production | HDI:5+N+5 | HDI:4+N+4 | HDI:5+N+5 | |