Key Specifications/Special Features:
24 layers
4+N+4 HDI
2.60mm thick
FR4(Tg180,CAF)
H OZ base copper on all layers
Drill bit 0.25mm
Green solder mask
Immersion gold surface finish
With impedance control
BGA pad size 0.28mm
Line width/space 4.0/5.0mil
Buried holes from L3 to L22
Laser via holes from L1 to L2, L2 to L3£¬L22 to L23, L23 to L24
Smart home application
