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20-layer HDI PCB with ENIG Surface Finish

Time£º2018/1/19 23:42:28
clicks£º721

Special Features:

20 layer,
HDI with 4+N+4 structure,
FR4(370HR) material£¬
3.5mm thick,
H OZ base copper on all layers,
ENIG surface finish, green solder mask,
Copper fill by VCP process,
Min w/s(line width/spacing) 4.0/5.0 mil,
Min BGA pad 0.45mm,
Min mechanical drill bit 0.30mm,
With Laser via holes from layer1 to layer 2, from layer 19 to layer 20. 
With buried holes from layer 2 to layer 19.
@ 2016 Kingshine Electronic Corporations All rights reserved. Guangdong ICP09646990 No.