Special Features:
12-layer
FR4 (Tg150) material
1.60mm thick
1 Oz finished copper on all layers
ENIG surface finish
Matte green solder mask
3.0/4.0mil min w/s (line width/spacing)
Min BGA pad size 0.25mm
Min drill bit 0.20mm
With blind holes from layer 1 to layer 8, from L12 to layer 9
Plug all blind holes with resin
