8-layered PCBs with ENIG Surface Finish

8 layer
HDI with 2+N+2 structure
FR4 (Tg170) material
1.60 mm thick
H OZ base copper on all layers
ENIG surface finish
Red solder mask
With impedance control
Min w/s(line width/spacing) 3.0/3.0mil
Min mechanical drill bit 0.20mm
Min BGA pad size 10.8mil
With Laser via holes from layer1 to layer 2 and from layer 2 to layer 3
From layer 6 to layer 7 and from layer 7 to layer 8
With buried holes from L3 to L6