Key Specifications/Special Features:
12-layer,
1+N+1 HDI,
rigid-flex board,
FR4(FR406) material,
1.86mm thick,
1 OZ finished copper on all layers,
ENIG surface finish,
black solder mask,
min. w/s(line width/spacing) 4.0/4.0mil,
min drill bit 0.20mm,
blind holes from L1 to L2 and from L12 to L11,
BGA pad size: 0.25mm,
flex part from L6 to L7,
with plasma process and VCP process.
