Top and down Asymmetric

8-layer
Rigid-flex board
FR4 (Tg170) material
0.80mm thick in the rigid area
0.35mm thick in the flex area (from L3 to L6)
0.5oz base copper on all layers
ENIG surface finish
Matte green solder mask
Min w/s (line width/spacing) 4.0/4.7mil
Min hole 0.20mm
Min BGA pad size: 0.30mm